Introduction to Business Operation

DPA/Construction Analysis and Failure Analysis

Space electronic devices need to be closely checked and analyzed deep into their structures to determine whether they are manufactured as designed or they have any hidden factors that may lead to failure when exposed to severe space environment. To do this, DPA and/or construction analysis are used.

Radiographic inspection Internal visual inspection Bond strength test / Die shear test
Radiographic inspection Internal visual inspection Bond strength test / Die shear test

- DPA (Destructive Physical Analysis) -

Analysis of finished products on the following external and internal items according to the established procedure:

  • External visual inspection
  • Physical dimensions
  • Radiographic inspection
  • Seal test
  • Internal water vapor content inspection
  • Internal visual inspection
  • Bond strength test
  • SEM inspection
  • Die shear test
Radiographic inspection
Radiographic inspection

- Construction Analysis -

Recent Large-Scale Integrated Circuits are becoming ever finer in structure.

The sturctural analysis is to analyze the state of fabrication of such fine structured devices.

The cross-sectional surface of LSI chips is observed and analyzed with a scanning electronic microscope.

Scanning Electron Microscope and Energy Dispersive X-ray Analysis Processing material for analysis by polishing
Scanning Electron Microscope and
Energy Dispersive X-ray Analysis
Processing material for analysis by polishing

- Construction Analysis -

Fault parts are checked using the latest information, DPA and structural analysis technology to locate the fault point, examine and analyze the cause.

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